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Asia Pacific: swop 2017 introduces interpack fair


The Shanghai World of Packaging (swop 2017) trade fair will for the first time introduce the Special Trade Fair by interpack. Concurrently held with interpack, the trade fair showcasing complete components and integrated automation solutions for the packaging industry, including:

• Drive technology,
• Industrial image processing,
• Sensors,
• Material handling technology,
• Industrial software and communications,
• Components and
• Control technology

With the shift to industry 4.0 and intelligent packaging, suppliers play an increasingly important role.

The key to success is to understand customers’ ideas, adapt to customers’ operating patterns and business modes, satisfy customers’ unique demands and deliver solutions in the time required.