At Pack Expo International 2014, Bosch Packaging Technology will showcase its complete systems competence, from processing to primary and secondary packaging to end-of-line technologies.
Two high-speed Seamless Systems designed to maximize overall equipment effectiveness (OEE) will be featured, including the global launch of the enhanced blow-fill-seal (BFS) packaging line.
It will also display Module++ capabilities, which link Bosch’s proven standard modules for customized processing and packaging solutions.
These lines integrate Bosch’s modular machines for adaptable and scalable end-to-end line solutions.
From processing through case packaging, Module++ allows for easy upgrades for manufacturers either taking their first steps with automation or bringing automation to the next level.
Seamless Systems
Developed with high productivity in mind, the Seamless Systems from Bosch feature a streamlined design for OEE.
The speed of all line components is balanced to eliminate bottlenecks, minimize downtime and optimize product flow.
In addition, the Seamless Systems are designed for ease of use, with the same look and feel across the entire line.
This makes operation as simple as using a machine, reducing the risk of operator error and increasing uptime.
For cracker packaging, Seamless Systems are designed for the gentle handling of delicate products at fast speeds.
The cracker packaging line features tandem slug portioning technology, which generates slug and half-slug pack size configurations with the same process speed.
After portioning, the crackers are sent to a flow wrapper that can easily handle both formats and ensures hermetic sealing with speeds ranging from 120 slugs to 250 half slugs per minute.
The system will include the Sigpack TTMC case packer, which is making its debut in North America and can handle both regular slotted and half slotted cases (RSC and HSC, respectively).
