Emballage show organizer Comexposium and The Dieline will launch The Dieline Summit in Paris, France from November 16 and 17, 2014.
The Dieline Summit will focus on rethinking the future of package design by leaders of the package design industry, who will discuss the issues that designers, consumers, and the world are facing.
The summit is aimed at helping professionals in Europe, the Middle East and Africa to gain recognition and respect by articulating what design means to their brands, and their expanding role as package designers.
“After our first collaboration showing The Dieline Awards winners at Emballage, we are delighted to host Andrew Gibbs’ The Dieline Conference in Paris this year,” says Véronique Sestrieres, director of Emballage and Manutention shows.
“When I began The Dieline in 2007, I had the goal of creating a resource and platform for the package design industry and its practitioners, leaders, students, and enthusiasts,” says founder of The Dieline Andrew Gibbs.
The organization holds The Dieline Conference, a package design conference, annually in the US.
“Our partnership with Emballage gives us the opportunity take this goal to the global stage. It allows us to further our mission of supporting, inspiring, and educating our industry’s leaders of today and tomorrow.”
