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Europe: Xeikon exhibits for the first time in Emballage

Xeikon will be exhibiting for the first time at Salon de l’Emballage 2014 in Paris, France, in November 2014. The company will present its enhanced...

Europe: FINAT Congress renames to European Label Forum, says organizer

FINAT, the international association for the self-adhesive label industry, has been renamed to European Label Forum (ELF) www.EuropeanLabelForum.com, which the annual event will take...

Americas: Ball’s food drive provides 700,000 meals in 37 communities

During Ball Corporation's 2015 Let's Can Hunger food drive, the company's North American employees donated more than 170,000 pounds of canned food and raised...

Americas: Toyo Ink Brasil exhibits at Label Latinoamerica 2015

Toyo Ink Brasil will be exhibiting eco-friendly inks and ultra-violet (UV) inks at Label Latinoamerica 2015 from August 26 to 28 at the Pro-Magno...

Europe: BASF presents coffee capsules at Fakuma 2015

BASF is presenting numerous new solutions for the packaging and furniture industry, automotive and electrical engineering at this year’s Fakuma, the international trade fair...

Asia Pacific: Rieke opens center in India

Rieke Packaging has opened its Global Innovation Center in Delhi, India for the industrial, food and beverage, and health, beauty and home care markets. "We...

Europe: What’s next for sustainable sourcing, asks summit

Sustainable sourcing has become fashionable in the food industry, with a growing number of companies making such commitments. However, the increasing number of sustainability...

Americas: Hayssen exhibits packaging machines in show

Hayssen Flexible Systems will exhibit integrated flow wrap system in conjunction with Thiele Technologies at Pack Expo 2016, November 6-9 in Chicago, US. The two...

Europe: Multivac participates in interpack 2017

Multivac will be presenting packaging solutions at interpack in Düsseldorf, Germany from May 4 to 10, 2017. The company will also be showing solutions...

Europe: pladis appoints Bosch Packaging Technology as supplier

The global biscuit and confectionery company pladis has signed a preferred supplier agreement with Bosch Packaging Technology at trade fair interpack 2017. By signing...