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Americas: Flint Group to engage visitors with discussions, presentations, machines at Labelexpo Americas

Flint Group Flexographic Products and Flint Group Narrow Web will display their most recent innovations at Labelexpo Americas from September 9 to 11 in...

Americas: AIPIA Congress explores profitability of active and intelligent packaging at Pack Expo 2014

The Active and Intelligent Packaging Association (AIPIA) will survey the role active and intelligent packaging technology can play in profitability during AIPIA’s Congress (November...

Americas: Husky World Tour in Mexico hosts specialty closures conference

In June 2014, Husky Injection Molding Systems hosted the first event of its Husky World Tour for 2014 – a specialty closures conference at...

Americas: Oystar Group to present packaging machines at Pack Expo 2014

The Oystar Group packaging machine manufacturer will present machines with manifold uses for the food and beverage industry at the Pack Expo 2014 in...

Europe: Arburg to present solutions for plastic parts production, future trends at Fakuma 2014

At trade exhibition Fakuma 2014, which takes place from 14 to 18 October in Friedrichshafen, Germany, Arburg will present 11 exhibits featuring innovative applications,...

Europe: Emballage 2014 expert team shares the future of packaging

The Pack Experts Committee of the international packaging exhibition Emballage 2014 continues to reflect on the packaging of tomorrow and its added value. Having gathered...

Europe: Successful brand identity factors, label industry trends shared at FINAT Congress

The label industry is no longer a separate and definable niche in the broader field of packaging print. It has a new and extended profile...

World: Henkel holds forums on food safe packaging in USA, Indonesia

After several Food Safe Packaging Forums in Europe, Henkel has now hosted its first events for the industry in Asia and in North America...

Europe: Emballage, The Dieline to host package design summit in France in November 2014

Emballage show organizer Comexposium and The Dieline will launch The Dieline Summit in Paris, France from November 16 and 17, 2014. The Dieline Summit will...

Americas: PMMI invites nominations Packaging Hall of Fame

PMMI, The Association for Packaging and Processing Technologies, the owner and producer of the PACK EXPO trade shows, is accepting nominations for the Packaging...
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