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Europe: Netstal, partners create first combining two packaging processes

Netstal presents injection compression molding on a stack mold at Fukama 2015. This innovation will be demonstrated using a 15 oz margarine tub made from...

Americas: Husky displays mold alignment solution at NPE 2015

Husky Injection Molding Systems will present its new self-cleaning mold technology for the HyPET HPP5 preform manufacturing system at NPE 2015 (March 23 –...

Asia Pacific: World of Food Beijing renames to ANUFOOD China

The 3rd edition of World of Food Beijing in China will be renamed to ANUFOOD China. Held from November 16 to 18, 2016 in Beijing,...

Europe: MULTIVAC to exhibit at interpack 2014

MULTIVAC will be represented at interpack 2014 by two exhibition stands in halls 5 and 17. In Hall 5, the company will present innovations covering...

World: Henkel holds food packaging webinar on migration

Henkel will be holding a webinar on the topic Basics in Migration - Adhesives in Food Packaging on May 29, 2015 at 10:00 AM...

Europe: Hanovia exhibits UV systems at BrauBeviale

Hanovia will be showcasing ultra violet (UV) technology for water and sugar disinfection systems, such as the Performance Qualified (PQ) validated system, at BrauBeviale...

Europe: Packaging, food source can be sustainable, states Summit

The food industry needs to take greater steps towards sustainable development, according to discussions at the Sustainable Foods Summit, hosted in Amsterdam, the Netherlands, on June...

World: DSM exhibits at Gulfood Manufacturing 2015

DSM will exhibit Halal certified health ingredients at Gulfood Manufacturing in Dubai from October 27 to 29, 2015. Named as the Company of the Year...

Americas: Haier, Astronautics, BASF present wine cooler at CES

Three companies presented a proof‑of‑concept wine cooler refrigerated by a magnetocaloric heat pump at the International Consumer Electronics Show in Las Vegas, Nevada, the...

Americas: Bosch to present packaging lines, systems at Pack Expo 2014

At Pack Expo International 2014, Bosch Packaging Technology will showcase its complete systems competence, from processing to primary and secondary packaging to end-of-line technologies. Two...

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